Mechanical Properties and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy.

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Mechanical Properties and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy

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ژورنال

عنوان ژورنال: Journal of Japan Institute of Electronics Packaging

سال: 2002

ISSN: 1343-9677,1884-121X

DOI: 10.5104/jiep.5.152